India has made a significant step towards self-reliance in chip technology with the launch of its first glass substrate-based advanced chip packaging unit in Odisha. The facility, set up by US-based 3D Glass Solutions Inc. at Info Valley in Bhubaneswar, promises to bring cutting-edge semiconductor packaging capability onshore for critical sectors.
The unit, which entails an investment of approximately ₹1,943 crore, will deploy advanced 3D heterogeneous integration (3DHI) packaging technology. This technology has been relied on imports so far, but the new facility will enable India to access it domestically.
Union Electronics and IT Minister Ashwini Vaishnaw hailed the launch as a 'historical day' for Odisha, pointing to the state's emergence as an IT hub and electronics manufacturing destination. The facility is expected to generate over 2,500 direct and indirect jobs and produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually.
The technology stack centred on glass interposers and embedded glass substrates represents a significant leap from conventional organic packaging, offering better thermal performance and higher integration density critical for AI-grade chips.
This is the second semiconductor facility to break ground in Odisha within months, following the launch of India's first commercial silicon carbide (SiC) fabrication unit at the same Info Valley campus.
