SHANGHAI—Huawei Technologies has developed a workaround to make chips on par with leading products manufactured by Intel and other top global companies by 2031, overcoming U.S. semiconductor technology barriers.
The Chinese company's approach allows it to make more-advanced chips without the one-of-a-kind machines its rivals use, which the U.S. has blocked it from accessing.
Huawei expects to design high-end chips by 2031 that match the transistor density of those manufactured with a 1.4-nanometer process, considered the next frontier for cutting-edge chips.
The company's solution focuses on improving computing efficiency, such as by stacking multiple layers of circuits within a single chip and reducing the time it takes to move data among them.
Whether Huawei will gain a distinct advantage remains to be seen, but its approach is at least an alternative path forward, a breakthrough it managed to find while facing supply chain challenges.
